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The Age of Software Definition in vehicles and automotive networks is here. The industry’s evolution toward Software Defined Vehicles (SDV) is accelerating, promising new driving experiences through the installation and upgrade of onboard software, just like smartphones. Simultaneously, Software Defined Networking (SDN), capable of dynamically adjusting network configuration and function through software, is also finding wider application.

Tesla of the US was the pioneer, but other companies are ramping up full-scale implementations as well, including major automobile manufacturers such as Volkswagen of Germany and Toyota of Japan, and a number of Chinese electric vehicle (EV) manufacturers.

One of the key constituent technologies in both SDV and SDN is automotive Ethernet, which offers much better speed, capacity, and affinity with existing information technology (IT) than conventional automotive local area networks (LAN) can deliver. Major European automotive manufacturers were the first to adopt the technology, with Japanese industry leaders including Toyota and Nissan following close behind.

New EV manufacturers are also rapidly adopting the tech. Sony Honda Mobility of Japan, for example, uses automotive Ethernet in its new AFEELA brand.

This event brings together experts from around the world—automotive manufacturing, parts makers, and more—to discuss and explain automotive Ethernet and the impact it is having on automobiles, as well as trends in next-gen automotive networks.

We hope you’ll join us there.

  

Outline

Name Automotive Ethernet Essential as Vehicles Evolve into Smartphones
Dates and times 13:00–17:40 Thursday, July 20, 2023 (planned)
10:00–16:30 Friday, July 21, 2023 (planned)
*Networking party held 17:45–19:15 on Thursday, July 20
*Lunch provided on Friday, July 21
Venue Shinagawa Intercity Hall
2-15-4 Konan, Minato-ku, Tokyo 108-0075 JapanMAP
Organizers Nikkei Electronics and Nikkei Automotive
Supported by JASPAR(Japan Automotive Software Platform and Architecture)
Sponsorship GAILOGIC/Technica Engineering,Intrepid Control Systems Japan,MARUBUN,Realtek Semiconductor,Rohde & Schwarz Japan,Toshiba Electronic Devices & Storage,Vector Japan,Winbond Electronics(Company name in ABC order)
Fee 79,800JPY (tax included) for two-day program
Capacity Capacity limited to 120 seats
Event may be cancelled if fewer than 40 tickets sold
Speakers, times and other program details subject to change.
Language English / Japanese *Simultaneous interpretation is attached

*There is a possibility to change the program

Program

13:00–17:40 Thursday, July 20, 2023 (planned)
13:00 - 13:40
The Latest Activity of JASPAR Next Generation High-Speed Network WG and Trends of Automotive Ethernet Industry
Mr.Hideki Goto

Mr.Hideki Goto
JASPAR Chair of Next Generation High-Speed Network WG
JASPAR(Toyota Motor)

Profile

Hideki Goto is a chair of JASPAR Next Generation High-Speed Network Working Group and works at Toyota Motor Corporation. He has been contributing standardization of automotive networks such as FlexRay, Bluetooth and Ethernet at JASPAR. He is also a board member of OPEN Alliance Inc, actively participating in standardization for automotive industry.

JASPAR has been working on development of core technologies for Automotive Ethernet and standardization. In this section, the latest activities of JASPAR working group such as an Automotive SDN (Software Defined Networking) and Optical Ethernet technologies will be introduced.

13:45 - 14:25
Automotive SDN Architecture for enabling SDV
Mr.Tatsuya Izumi

Mr.Tatsuya Izumi
Team Leader, SDN Study & Verification Team
JASPAR Next Generation High-Speed Network WG
JASPAR (Sumitomo Electric Industries)

Profile

He started his career from research and development of in-vehicle communication and architecture, and in recent years has been engaged in network products development including automotive Ethernet. He is also a member of JASPAR Next Generation High-Speed Network Working Group from 2016. He leads the SDN Study & Verification Team from 2023.

Even after the SDV is supplied on the market, the vehicle evolves due to additions and changes in the software. Therefore, an innovative in-vehicle architecture with flexibility is necessary to add or change functions through software, allowing the in-vehicle network to realize functional additions and changes. JASPAR is studying applying the SDN (Software-Defined Networking) concept to in-vehicle networks and defines this as automotive SDN. SDN is a system that can dynamically update network configuration in the ICT field. For SDV, this presentation proposes a new in-vehicle architecture to realize a network that applies automotive SDN. Specifically, we define the minimum requirements for in-vehicle SDN based on use cases and define the prerequisites for an in-vehicle network, proposing a reasonable logical and physical architecture from the viewpoint of these constraints.

14:30 - 15:10
Sony Honda Mobility - Aiming to Create New Value Standard for Mobility
Mr.Takuya Nishibayashi

Mr.Takuya Nishibayashi
E&E System Architecture Development Division, Head of Division, General Manager
Sony Honda Mobility

Profile

Joined Sony Corporation after working at Japanese PC manufacturer. Involved in the development of VAIO and digital cameras as a software project leader and system architect. After working on Android tablet and smartphone development as a platform and security feature manager, oversaw software development for the “aibo” and “poiq” entertainment robots and the “Airpeak” aerial drone, as well as being responsible for security design, including OTA for the electric vehicle prototype “VISION-S”. Joined Sony Honda Mobility Inc. in December 2022 as one of the company's early members.

Sony Honda Mobility aims to provide high-value products and services in mobility, establishing a new relationship with customers. At CES 2023, the company announced the new brand for their electric vehicle (EV), "AFEELA" and showcased a prototype, which proposes a new relationship between people and mobility. With the values of 3As – Autonomy, Augmentation and Affinity, Sony Honda Mobility aims to create new value in mobility. In the presentation, the company will explain the evolution of mobility, focusing on cybersecurity for the era of in-vehicle Ethernet.

15:30 - 16:10
The Latest Status of Optical Transmission in Automotive Ethernet
- Assessment of 10GBASE-AU Optical Automotive Ethernet through a combined approach of experimental and numerical analyses -
Mr.Masato Shiino

Mr.Masato Shiino
Sub-Team Leader, Physical Layer Sub-Team, Next Generation Technology Study Team,
JASPAR Next Generation High-Speed Network WG
JASPAR (FURUKAWA ELECTRIC)

Profile

Masato Shiino is the leader of the Physical Layer Subteam of the JASPAR Next Generation High Speed Network Working Group and a Senior Engineer of the Mobility Technology Development 2 of the Electronics Laboratory of FURKAWA ELECTRIC CO., LTD.
He joined FURUKAWA ELECTRIC in 1988. Since joining the company, he has been mainly engaged in the development of optical connectors and connection components for information and telecommunications, and is currently engaged in the development of optical harnesses for automotive applications.

The Physical Layer Subteam of the JASPAR Next Generation High Speed Network Working Group is working on establishing requirements for next generation in-vehicle communication (IEEE standard (optical (10Gb/s), electrical (10Gb/s, 10Mb/s)). In this presentation, we will focus on the automotive optical communication, which is in the process of standardization, and will introduce the use cases and test points envisioned by JASPAR, as well as the evaluation results of optical fiber and VCSEL light sources applied to automotive optical communication.

16:15 - 16:55
Challenges in Zonal Architecture Implementation
Mr.Colt Correa

Mr.Colt Correa
Chief Operating Officer(COO)
Intrepid Control Systems

Profile

Colt currently serves as Chief Operating Officer at Intrepid Control Systems where he has worked for 17 years. Colt has more than 24 years of experience working on software and electronics hardware with numerous types of vehicle networks including CAN, FlexRay, LIN, MOST, Ethernet and the author of a leading book in this field, now in its second edition, titled "Automotive Ethernet - The Definitive Guide". He has also authored numerous IEEE and SAE publications, and has been awarded 6 U.S. patents. Colt holds a Master of Science in Electrical Engineering from the University of Michigan, where he wrote his thesis on interactive engine and transmission controls while employed as a controls engineer at Chrysler (Stellantis).

Future zonal architectures will be built from Automotive Ethernet standards such as 1000BASE-T1, 10BASE-T1S and MultiGBASE-T1 carrying data from numerous domains mixed on the same network. As a result, there will be new challenges in testing and validation of these architectures. Network power modes, high bandwidth data logging, and testing will be discussed.

17:00 - 17:40
The issues among multiple automotive Ethernet standards and JASPAR’s efforts towards them
Dr.Takumi Nomura

Dr.Takumi Nomura
Vice Chair, JASPAR Next Generation High-Speed Network WG
JASPAR(Honda Motor)

Profile

Takumi Nomura is the vice-chair of JASPAR Next Generation High-Speed Network Working Group and a Chief Engineer of Honda Motor Co., Ltd. He received his PhD in Engineering from Kyushu University, Japan. Before joining Honda, he was engaged for 15 years in research on applied technology of Ethernet. His current research interests include the next generation E/E architecture and automotive Ethernet technologies.

With the spread of in-vehicle Ethernet, IEEE and multiple organizations, such as AUTOSAR, OPEN Alliance, and AVnu Alliance, have started developing standards. Unfortunately, the conflicts that cause various harmful effects can naturally arise among multiple standards. Against this background, this presentation introduces some conflicts between standards and examples of JASPAR’s effort to solve them. Finally, the presenters want to call on the audience to ensure that various standards cooperate.

10:00–16:30 Friday, July 21, 2023 (planned)
10:00 - 10:40
Ethernet @ BMW 2023
Dr.Kirsten Matheus

Dr.Kirsten Matheus
Senior Expert for In-vehicle Communication Technologies
BMW

Profile

Dr Kirsten Matheus is engineer and economist. Since 2003, she has worked in the automotive industry; since 2009 at BMW. At BMW she is responsible for the strategy for the in-vehicle networking technologies. This entails ensuring the availability of suitable in-vehicle networking technologies well before application engineers want to use them. In this context she successfully introduced Ethernet as a networking technology into the automotive industry. In her opinion, only open standards provide the basis for long term sustainability of networking technologies. She and her former colleague Thomas Königseder describe their experiences, background and technical concepts behind the use of Ethernet in the automotive industry in a book titled “Automotive Ethernet”. Her new book, co-authored by her colleague Michael Kaindl, “Automotive High Speed Communication Technologies, SerDes and Ethernet for Sensor and Display Applications”, appeared in Autumn 2022.

In 2023, BMW is looking back on 15 years of experience with Ethernet in series production cars. During this time, BMW has continuously extended the number of Ethernet nodes as well as the functionality of the Ethernet network in its cars. This refers to supported data rates as well as to supported networking capabilities (security, diagnostics, …). Looking forward, BMW intends to further extend its in-vehicle Ethernet network. This presentation elaborates on the architecture induced changes (“zonal”) and the challenges and solutions this offers. The extension to lower data rates (10BASE-T1S) as well as higher data rates (MGBASE-T1 as well as ASA-ML) each have different implications that will be discussed in detail.

10:45 - 11:25
Functional Safety (ISO 26262) in In-vehicle Ethernet
~JASPAR Analysis results ~
Dr. Yasuhiro Yamasaki

Dr. Yasuhiro Yamasaki
JASPAR Functional Safety WG Communication Team Leader
JASPAR(Toyota Motor)

Profile

After Dr. Yasuhiro Yamasaki engaged in research and development of communication technology in the ICT field, he has participated in the development of in-vehicle Ethernet technology. He currently engages in in-vehicle communication safety (functional safety and quality of service (QoS)) and advanced technology development (Ethernet AVB/TSN and SDN). He is the JASPAR Functional Safety WG Communications Team Leader, a researcher at the Kwansei Gakuin University. He works for Toyota Motor Corporation.

This presentation introduces the method/concept of supporting the functional safety standard (ISO 26262) in In-vehicle Ethernet. In-vehicle Ethernet is expected to be used more widely in the future. On the other hand, due to the complex protocol structure and the use of OSS (Open-Source Software), it is difficult to take conventional functional safety measures (functional safety measures are implemented for all communication elements). In this presentation, we will introduce functional safety measures that incorporate the concept of black channel, which can also be applied to In-vehicle Ethernet.

11:30 - 12:10
Automotive IVNs
EVOLUTION OF IN VEHICLE NETWORKS TO ZONAL AND ITS TESTING CHALLENGES
Mr.Tristen Tan

Mr.Tristen Tan
Business Development Manager
Rohde & Schwarz

Profile

Mr Tristen Tan has over 20 years of experience in Test & Measurement. Currently at Rohde & Schwarz, he takes care of Oscilloscope’s Product and Business Development for the Asian South Pacific Region. In his early Career, he has work on High Speed Serial, Power Integrity and Time domain reflectometry. Tristen graduated from The University of Queensland with BEng (Hons) in Electrical Engineering.

With cars of the future moving towards software-defined vehicles demanding a more common and scalable architecture, the current distributed network architecture has reached the limit of its capabilities. Focus has moved to zonal controller architecture to simplify network design, reduce weight and cost yet maximize performance. This session explores these challenges that new interfaces such as Automotive Ethernet poses and provides insight into the tools to verify and debug high-speed digital links.

12:10 - 13:10
Break
*Lunch will be served.
13:10 - 13:50
Challenges of Multi-Giga Ethernet for Next-Generation E/E Architecture
Mr. Yasuhiro Kotani

Mr. Yasuhiro Kotani
Semiconductor-Originated Key Technologies R&D Division, In-Vehicle Network R&D Department, R&D Section 3, Project Assistant Manager
DENSO

Profile

Yasuhiro Kotani joined DENSO in 2011 after working in research and development of optical communication systems at a telecommunications equipment manufacturer. And then he was involved in the mass production design of electronic control units (ECUs) for European automotive manufacturers. Since 2016 he has been dedicated to the development of automotive communication and network technologies, with a focus on automotive Ethernet. He is a member of the Next-Generation High-Speed LAN Working Group at the Japan Automotive Software Platform and Architecture (JASPAR) and also serve on the organizing committee of the IEEE Ethernet & IP @ Automotive Technology Day.

The development of autonomous driving technologies and SDVs is accelerating, and there is a need for faster, real-time communication. As a result, the range of applications for automotivee Ethernet has expanded, and communication speeds have evolved from 100Mbps to 1Gbps and then to multi-gigabit. However, in order to accommodate such high-speed communications, the Electronic Control Unit (ECU) design increases in difficulty in terms of SI(Signal Integrity)/PI(Power Integrity)/EMC(Electro-magnetic Compatibility). In this presentation, ECU hardware design and EMC performances for multi-gigabit Ethernet are explained.

13:55 - 14:35
Growing Automotive Ethernet Communication Evaluation and Vector Solution
Mr. Yasushi Kawamura

Mr. Yasushi Kawamura
Network & Distributed Systems, Network Interface Dev./
Senior Field Application Engineer
Vector Japan

Profile

Since around 2000, I have worked mainly for OEMs and suppliers in the automotive industry as a developing software for ECUs, system design, and component design engineer.
So, I have experienced a wide range of work from software to hardware.
Currently, as a member of a tool vendor, I am proposing solutions focusing on Ethernet and EV communication.

As stated in the purpose of this event, SDV is transforming in-vehicle systems into software-centric systems.
Software-centric systems require faster development speed and continuous development.
Therefore, development evaluation methods for in-vehicle systems are also changing.
In this presentation, we will introduce Vector solution for the evaluation of in-vehicle Ethernet communication in both virtual and real environments.

14:40 - 15:20
BYD 'SEAL' Teardown and Tesla's Ethernet Strategy
Tadashi Nakamichi

Tadashi Nakamichi
Editor-in-chief of Nikkei Electronics
Nikkei BP

Nikkei BP has disassembled and analyzed Nissan "Leaf", Tesla "Model 3", Volkswagen "ID.3", and Toyota Motor "Mirai (with Advanced Drive)". This time, we disassembled BYD's "SEAL". In this presentation, he will mainly focus on the in-vehicle network, and present the his analysis of the characteristics of SEAL and the differences from other vehicles. He will also touch on Tesla's in-vehicle Ethernet strategy for its next-generation platform.

15:40 - 16:30
Q&A Session to Automobile Manufacturers
Mr.Hideki Goto

Mr.Hideki Goto
JASPAR Chair of Next Generation High-Speed Network WG
JASPAR(Toyota Motor)

Dr.Takumi Nomura

Dr.Takumi Nomura
Vice Chair, JASPAR Next Generation High-Speed Network WG
JASPAR(Honda Motor)

Dr.Kirsten Matheus

Dr.Kirsten Matheus
Senior Expert for In-vehicle Communication Technologies
BMW

Mr. Yasuhiro Kotani

Mr. Yasuhiro Kotani
Semiconductor-Originated Key Technologies R&D Division, In-Vehicle Network R&D Department, R&D Section 3, Project Assistant Manager
DENSO

Moderator
Tadashi Nezu
Deputy editor-in-chief, Nikkei xTECH
Nikkei BP

  • *Networking party held 17:45–19:15 on Thursday, July 20
  • *Lunch provided on Friday, July 21
  • *There is a possibility to change the program

Notes on Registration

*Registration will be closed when it reaches the maximum capacity. You are encouraged to proceed registration at the earliest time.
*This seminar secretariat may contact you by e-mail or telephone.

Please fill in all fields. If you do not fill in the required fields, your registration will not be completed.
Please make sure that your e-mail address is correct (you will receive confirmation of your registration by e-mail registered). In case that you do not receive the confirmation email from the secretariat, please contact nikkeibp_2023@semiconportal.com
Automotive Ethernet Tech Days 2023
Thursday, July 20, 2023, 13:00-17:40 (Doors open at 12:30)
Friday, July 21, 2023, 10:00 - 16:30 (Doors open at 9:30)
A networking session for participants will be held after the session on Thursday, July 20, 2023 (17:45-19:15).

Registration Fee for 2-day seminar: 79,800JPY (Tax included)
Registration fee includes social event on 7/20 and lunch on 7/21.

Registration for the course has closed.

日経BP